Showing results: 121 - 135 of 232 items found.
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Intego GmbH
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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RocketSim -
Cadence Design Systems
Complementing compiled-code simulators, Cadence® RocketSim™ parallel simulation engine eliminates functional verification bottlenecks by speeding up simulation using commonly available multi-core servers. The engine is proven for register-transfer level (RTL) system on chip (SoC), gate-level functional simulation, and gate-level design for test (DFT) simulation in numerous marquee systems and semiconductor companies in the mobile, server, and graphics domains. Ever-growing chip density and complexity slow down simulation, making functional verification a severe bottleneck. As a result, chip design projects miss their time-to-market targets, or designers end up taping out early with less confidence. RocketSim parallel simulation engine solves the bottleneck common in existing compiled-code simulators by offloading the time-consuming calculations to an ultrafast multi-core engine.
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Synopsys, Inc.
Synopsys ZeBu® emulation system delivers the performance needed to make verification teams and software developers working on the most advanced chips successful. ZeBu emulation systems are modular, allowing users to deploy the capacity needed in a scalable and easily extensible fashion.
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ComEth4050e -
ELMA Electronic, Inc.
The ComEth 4050e is a cutting-edge 6U cPCI Layer 2/3 Ethernet switch for PICMG 2.16 & VITA 31.1 systems and is powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
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ETF-SERIES -
Envisys Technologies
Precise Temperature Accuracies with Reliable Test Results Temperature Limits: -40/-60 °C to 30 °C Temperature Accuracies: ±2-3°C Temperature Rate of Change: 20-25 deg /min (Non-linear) Maintenance Free Access to The System Self-Sufficient System Compact with small footprints suitable for any space constraint laboratories Low decibel system Suitable for testing electronic chips / devices Environmentally friendly refrigerants Efficient heating Microprocessor based single set point PID temperature controller with data logging Flexible hose up to 2.5-3.0m Interchangeable heads according to chip size. Inbuilt electrical control panel with switchgear system
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Exodus Advanced Communications
Exodus Narrowband CW and Linearized SSPA products feature LDMOS, GaN,GaAsFET discrete and Chip & Wire Hybrid technologies covering frequency ranges from 1MHz to 26.5GHz at power levels exceeding 1KW for Modules and 10KW for Systems
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Analog Devices Inc.
Analog Devices wideband transceiver ICs offer a complete, high performance RF and mixed-signal system on a chip. ADI’s ISM transceivers for short range wireless systems and wideband transceivers for wireless applications such as UMTS, LTE, and 3G/4G are highly integrated and deliver best-in-class performance and significant BOM savings.
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PAS 5500 -
ASML
In 1991, seven years after the company was founded, we launched the PAS 5500, which turned out to be our breakthrough platform. This system was able to dramatically reduce manufacturing times for our customers, and its modular design enabled them to produce multiple generations of advanced chips using the same system.
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Giga-snaP™ -
Ironwood Electronics
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Exodus Advanced Communications
Exodus Broadband SSPA products feature LDMOS, GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from 1MHz to 24.5GHz at power levels exceeding 500W for Modules and 3KW for Systems.
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Renesas Electronics Corp.
The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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UF3000EX-e -
CSE Co.,Ltd
Wafer Probe Station is used in connection with test system in Wafer Test process.It is a device to move wafer automatically to examine fair quality of individual chip on the wafer. Probe Station is seperated depending on purpose. For analysis, for mass production as well as manual, semi-automatic, full-automatic.
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SSI-TRES -
Transducer Techniques, Inc
Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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AOI -
ficonTEC Service GmbH
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
